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    • Electronic Encapsulating Compound

    Electronic Encapsulating Compound is a high-performance material designed to protect electronic components, such as microelectronics, semiconductors, and LEDs, from environmental stressors. This compound provides a robust barrier against moisture, dust, chemicals, and temperature extremes, ensuring reliable performance and longevity of the electronic device.

    • ASP-1120 A/B
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      Shin Etsu

      ASP-1120 A/B

      ASP-1120 A/B Download ASP-1120A SDS Download ASP-1120B SDS Download ASP-1120A/B TDS PRODUCT DESCRIPTION: Shin-Etsu's ASP-1120 A/B is a dual component, heat cure LED potting encapsulant that is designed for use in conjunction with Shin-Etsu's KER-2000...

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